Electronic Equipment Technology

Electronic Equipment Technology
454-0095/02
čeština Electronic Equipment Technology
454-0095/01
čeština

Summary

Materials for accurate mechanics and weak-current electrotechnics. Isulative varnish. Electro-conductive adhesive. Procedure at circuit construction on printed circuits. surface connection production technology. printed circuit design computer support technology and of its production. Solder, soldering and cleaning. soldered joint Metallography. Flux. Soldering flux. Component and its assembly on board. Component for surface assembly. SMD parts assembly. Qualifying test. hybrid circuit technology.

Literature

Musil, V. a kol.: Construction ang technology of elektronic devices, PC DIR Brno, 1994
Strauss, R.: Surface mount technology, Butterworth - Heinemann, 1994
Szendiuch, I.: Microelektronic montage technology, VUTIUM Brno, 1997

Advised literature

No advised literature has been specified for this subject.

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Language of instruction	čeština, čeština
Code	454-0095
Abbreviation	TEZ
Course title	Electronic Equipment Technology
Coordinating department	Department of Telecommunications
Course coordinator	Ing. Radek Novák, Ph.D.