1. Materials for conductors, resistivity, surface phenomenon, silvering, stranded conductors, insulated conductors, planar printed circuit boards, heat dissipation. Resistance materials. Contact materials.
2. Magnetic materials, magnetic quantities and circuits (transformers, relays), magnetically soft and hard materials, losses in magnetic circuits (eddy currents, hysteresis losses, hysteresis curve), magnetic circuits with permanent magnets (speakers, polarized relays).
3. Heat removal from electronic devices, cooling by radiation, conduction and flow, forced flow (fans) and natural (chimney effect), types of fans, noise.
4. Materials for heatsinks, thermal conductivity, types of ribbing, heat pipes, materials for heat dissipation from semiconductor components. Construction materials. IP protection.
5. Vacuum technology, HF components of high power, HF generators, technological equipment (hybrid IC, thin film evaporation), electron microscopy, special components (HFD, discharge lamps, mercury switches, X-ray sources, power lasers). Metals, glasses, ceramics and organic materials suitable for vacuum technology.
6. Semiconductor materials, electron and hole conductivity, mobility, semiconductor materials with direct and indirect band gap. Basic semiconductors (silicon, germanium, carbon), their use. Semiconductors as compounds of group AIIIBV, AIIBVI…, materials for generation and conduction of optical radiation, chalcogenide glasses.
7. Materials for insulators, thermoplastics (polyethylene, polypropylene, polystyrene, PVC, PMMA, polycarbonates, polyamides, PTFE, polyimides) and thermosets (phenoplasts, epoxies and polyesters).
8. 3D printing, HW solutions for 3D printing, SW support, plating.
9. Printed circuits and their composition (copper foil, reinforcement, binder), basic properties of printed circuit boards (temperature coefficient, wettability, dielectric losses, permittivity…). Types of printed circuit boards FR2 to FR6, special printed circuit boards (polyimide, PTFE, composite materials,…), flexible printed circuit boards, inorganic printed circuit boards (beryllium ceramics, corundum). Production of printed circuit boards.
10. Principles of printed circuit board design from the point of view of electrical, dimensioning of conductive paths, HF adaptation, microstrip lines, undesired capacitive, inductive connections. PCB design for linear, switched power supplies, PCBs for digital systems, clock signal distribution, PCBs for analog technology, input and output circuits, specifics of A / D and D / A converters, Latch-Up protection, ESD protection.
11. Principles of PCB design in terms of production technology, differences between wave soldering and remelting, blind grips, solderless mask, printing Mic Microvia technology. Wrapped joint technology. Hard and soft solders, solderability problems, lead-free solders, fluxes.
12. Discrete electronic component housings and integrated circuit housings. Assembly automats.
13. EMC. Electric field interference, magnetic field, electromagnetic and galvanic interference. Electrical and magnetic shielding, suitable materials.
14. Design of the instrument cabinet with regard to strength, safety, thermal and shielding properties.
2. Magnetic materials, magnetic quantities and circuits (transformers, relays), magnetically soft and hard materials, losses in magnetic circuits (eddy currents, hysteresis losses, hysteresis curve), magnetic circuits with permanent magnets (speakers, polarized relays).
3. Heat removal from electronic devices, cooling by radiation, conduction and flow, forced flow (fans) and natural (chimney effect), types of fans, noise.
4. Materials for heatsinks, thermal conductivity, types of ribbing, heat pipes, materials for heat dissipation from semiconductor components. Construction materials. IP protection.
5. Vacuum technology, HF components of high power, HF generators, technological equipment (hybrid IC, thin film evaporation), electron microscopy, special components (HFD, discharge lamps, mercury switches, X-ray sources, power lasers). Metals, glasses, ceramics and organic materials suitable for vacuum technology.
6. Semiconductor materials, electron and hole conductivity, mobility, semiconductor materials with direct and indirect band gap. Basic semiconductors (silicon, germanium, carbon), their use. Semiconductors as compounds of group AIIIBV, AIIBVI…, materials for generation and conduction of optical radiation, chalcogenide glasses.
7. Materials for insulators, thermoplastics (polyethylene, polypropylene, polystyrene, PVC, PMMA, polycarbonates, polyamides, PTFE, polyimides) and thermosets (phenoplasts, epoxies and polyesters).
8. 3D printing, HW solutions for 3D printing, SW support, plating.
9. Printed circuits and their composition (copper foil, reinforcement, binder), basic properties of printed circuit boards (temperature coefficient, wettability, dielectric losses, permittivity…). Types of printed circuit boards FR2 to FR6, special printed circuit boards (polyimide, PTFE, composite materials,…), flexible printed circuit boards, inorganic printed circuit boards (beryllium ceramics, corundum). Production of printed circuit boards.
10. Principles of printed circuit board design from the point of view of electrical, dimensioning of conductive paths, HF adaptation, microstrip lines, undesired capacitive, inductive connections. PCB design for linear, switched power supplies, PCBs for digital systems, clock signal distribution, PCBs for analog technology, input and output circuits, specifics of A / D and D / A converters, Latch-Up protection, ESD protection.
11. Principles of PCB design in terms of production technology, differences between wave soldering and remelting, blind grips, solderless mask, printing Mic Microvia technology. Wrapped joint technology. Hard and soft solders, solderability problems, lead-free solders, fluxes.
12. Discrete electronic component housings and integrated circuit housings. Assembly automats.
13. EMC. Electric field interference, magnetic field, electromagnetic and galvanic interference. Electrical and magnetic shielding, suitable materials.
14. Design of the instrument cabinet with regard to strength, safety, thermal and shielding properties.