Lectures:
Materials used for manufacturing of microelectronic devices, clean room. Silicon single/crystal grouth and wafering.
Basics of solid state technology. Physical and chemical methods for preparation of thin film layers .Epitaxial growth.
Introduction of dopants into silicon. Thermal diffusion and ion implantation.
Method for processing of layers. Lithography. Chemical etching. Dry etching.
Assembly of microelectronic devices. Testing and reliability programs. Diagnostic methods in semiconductor device manufacturing.
Technology of bipolar and unipolar ICs. Planar technology. Isoplanar, I2L, CMOS, BiCMOS.
Microtechnology as the technology for microelectronic sensor manufacturing. Micromaschining.
Materials used for manufacturing of microelectronic devices, clean room. Silicon single/crystal grouth and wafering.
Basics of solid state technology. Physical and chemical methods for preparation of thin film layers .Epitaxial growth.
Introduction of dopants into silicon. Thermal diffusion and ion implantation.
Method for processing of layers. Lithography. Chemical etching. Dry etching.
Assembly of microelectronic devices. Testing and reliability programs. Diagnostic methods in semiconductor device manufacturing.
Technology of bipolar and unipolar ICs. Planar technology. Isoplanar, I2L, CMOS, BiCMOS.
Microtechnology as the technology for microelectronic sensor manufacturing. Micromaschining.