- Basic characteristics of electrical materials and requirements to them. Technology of preparation of physically and chemically highly pure materials. Physical, chemical and physical-chemical methods of refining metallic and non-metallic materials and their characterisation.
- New types of electronic, opto-electronic and magnetic elements. Influence of electrically active elements on the properties of electronic components.
- Materials with high electrical conductivity. Materials for contacts, thermocouples, bi-metals, solders, resistance materials. Superconductivity. Low-temperature and high-temperature superconductors.
- Current technologies for production of semiconductor materials and integrated circuits, overall structure of technologies applied in micro-electronics, evolution and types of technologies, preparation of pads (substrates), bases of photo-lithography, basic materials used at creation of structure of semiconductor elements.
- Elemental semiconductors and compounds, dielectric-layer and methods for their creation, metallic contacts and internal connections, micro-alloying, defects of semiconductor elements, principles of control and automation of technological processes.
- Influence of geometrical dimensions on the properties of solids. Properties of nano-crystals and crystallisation nuclei, basic stages of formation of nano-layers and areas of their application, dimensional effects in the structure of electronic components.
- Miniaturisation and topology of electronic devices, technological operations and functional properties of components, mechanisms of degradation of electronic elements.
- Mechanism of elemental processes of growth of thin layers by epitaxy (VPE, LPE, MBE, MO CVD), by evaporation, by sputtering and ion implantation, by mechanisms of diffusion processes in semiconductors.
- Principle of selectivity and procedures of technological operations in micro-electronics. Basic criteria for evaluation of local operations, methods of creation of topological pattern on a substrate, masking, locally activated operations, topological transformations and creation of additional structural elements using selective operations.
- Creation of horizontal and vertical structures. Lithographical methods. EUV lithography, electron and ion projection lithography. Reactive ion etching. Technology for preparation of quantum dots based on semiconductors.
- Final operations, physical methods for control of defects, composition and circuits for local operations, principal conditions for elimination of mechanical joints. Methods LP CVD, LE CVD, PETEOS. Micro- and nano-fabrication.
- Micro-optoelectronics, compounds AIIIBV, AIIBVI…, materials for laser technology, radiation detectors, solar technology.
- Magnetic and dielectric materials. Oxide materials for memory elements (ferrites, ferro-electrics), materials for bubble memories (garnets).
- Liquid crystals. Nematic, lamellar and columnar systems - structure and its transformations, materials for special purposes, whiskers. Material engineering in micro-electronics.
- New types of electronic, opto-electronic and magnetic elements. Influence of electrically active elements on the properties of electronic components.
- Materials with high electrical conductivity. Materials for contacts, thermocouples, bi-metals, solders, resistance materials. Superconductivity. Low-temperature and high-temperature superconductors.
- Current technologies for production of semiconductor materials and integrated circuits, overall structure of technologies applied in micro-electronics, evolution and types of technologies, preparation of pads (substrates), bases of photo-lithography, basic materials used at creation of structure of semiconductor elements.
- Elemental semiconductors and compounds, dielectric-layer and methods for their creation, metallic contacts and internal connections, micro-alloying, defects of semiconductor elements, principles of control and automation of technological processes.
- Influence of geometrical dimensions on the properties of solids. Properties of nano-crystals and crystallisation nuclei, basic stages of formation of nano-layers and areas of their application, dimensional effects in the structure of electronic components.
- Miniaturisation and topology of electronic devices, technological operations and functional properties of components, mechanisms of degradation of electronic elements.
- Mechanism of elemental processes of growth of thin layers by epitaxy (VPE, LPE, MBE, MO CVD), by evaporation, by sputtering and ion implantation, by mechanisms of diffusion processes in semiconductors.
- Principle of selectivity and procedures of technological operations in micro-electronics. Basic criteria for evaluation of local operations, methods of creation of topological pattern on a substrate, masking, locally activated operations, topological transformations and creation of additional structural elements using selective operations.
- Creation of horizontal and vertical structures. Lithographical methods. EUV lithography, electron and ion projection lithography. Reactive ion etching. Technology for preparation of quantum dots based on semiconductors.
- Final operations, physical methods for control of defects, composition and circuits for local operations, principal conditions for elimination of mechanical joints. Methods LP CVD, LE CVD, PETEOS. Micro- and nano-fabrication.
- Micro-optoelectronics, compounds AIIIBV, AIIBVI…, materials for laser technology, radiation detectors, solar technology.
- Magnetic and dielectric materials. Oxide materials for memory elements (ferrites, ferro-electrics), materials for bubble memories (garnets).
- Liquid crystals. Nematic, lamellar and columnar systems - structure and its transformations, materials for special purposes, whiskers. Material engineering in micro-electronics.