- Basic reasons and goals of structure characterization at a wide range of length scales (macrostructure, microstructure, nanostructure). Comparison of spatial resolution limits of microscopic techniques.
- Light microscopy. Principle of light microscope. Preparation of specimens. Typical tasks of light microscopy at quality control of materials – microstructure, micro-cleanliness and grain size. Quantitative metallography, automated image analysis. Analysis of projected images. Errors of measurement.
- Interaction of X-ray and electrons with specimens. Basic rules for reciprocal lattice. Geometrical conditions of diffraction. Bragg´s law and Ewald sphere.
- X-ray diffraction analysis of polycrystalline materials. Typical tasks of X-ray diffraction analysis. Quantitative analysis – methods of internal and external standards, standardless analysis.
- Evaluation of residual stresses. Macro-stress, determination of particle size in coarse grained materials. Principles of texture evaluation. X-ray diffraction analysis on single crystals. X- ray fluorescence analysis. Neutron diffraction.
- Instruments based on focused electron beam. Principles of transmission and scanning electron microscopes.
- Contrast mechanisms in transmission electron microscopy: amplitude, phase and Z contrasts. Basic principles of kinematic and dynamic theory of electron scattering, contrast on crystallographic defects.
- High resolution transmission electron microscopy (HRTEM). Preparation of specimens for transmission electron microscopy.
- Focused ion beam microscopy. Interaction of ions with solid matter. Basic functions of FIB: milling, deposition, implantation, imaging. Ga+ source. Negative effects of FIB. Dual beam FIB/SEM, applications.
- Electron diffraction techniques: selected area diffraction and convergent beam diffraction. Interpretation of diffraction patterns from single crystals and polycrystalline materials. EDX and EELS techniques.
- Contrast mechanisms in scanning electron microscopy. Interpretation of images in secondary electrons and in backscattered electrons. Electron back scattered diffraction (EBSD).
- X ray microanalysis: wave and energy dispersive analyses (EDX and WDX). Auger spectroscopy.
- Probe scanning microscopy: AFM, STM and MFM. Field ion microscopy and atom probe tomography (APT). Examples of structure characterization in the field of materials engineering.
- Light microscopy. Principle of light microscope. Preparation of specimens. Typical tasks of light microscopy at quality control of materials – microstructure, micro-cleanliness and grain size. Quantitative metallography, automated image analysis. Analysis of projected images. Errors of measurement.
- Interaction of X-ray and electrons with specimens. Basic rules for reciprocal lattice. Geometrical conditions of diffraction. Bragg´s law and Ewald sphere.
- X-ray diffraction analysis of polycrystalline materials. Typical tasks of X-ray diffraction analysis. Quantitative analysis – methods of internal and external standards, standardless analysis.
- Evaluation of residual stresses. Macro-stress, determination of particle size in coarse grained materials. Principles of texture evaluation. X-ray diffraction analysis on single crystals. X- ray fluorescence analysis. Neutron diffraction.
- Instruments based on focused electron beam. Principles of transmission and scanning electron microscopes.
- Contrast mechanisms in transmission electron microscopy: amplitude, phase and Z contrasts. Basic principles of kinematic and dynamic theory of electron scattering, contrast on crystallographic defects.
- High resolution transmission electron microscopy (HRTEM). Preparation of specimens for transmission electron microscopy.
- Focused ion beam microscopy. Interaction of ions with solid matter. Basic functions of FIB: milling, deposition, implantation, imaging. Ga+ source. Negative effects of FIB. Dual beam FIB/SEM, applications.
- Electron diffraction techniques: selected area diffraction and convergent beam diffraction. Interpretation of diffraction patterns from single crystals and polycrystalline materials. EDX and EELS techniques.
- Contrast mechanisms in scanning electron microscopy. Interpretation of images in secondary electrons and in backscattered electrons. Electron back scattered diffraction (EBSD).
- X ray microanalysis: wave and energy dispersive analyses (EDX and WDX). Auger spectroscopy.
- Probe scanning microscopy: AFM, STM and MFM. Field ion microscopy and atom probe tomography (APT). Examples of structure characterization in the field of materials engineering.