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Electronic Equipment Technology

Summary

Computer aided design of printed circuit board. Design of wiring diagram, PCB, documentation. Printed circuit board technology, multilayer PCB, materials for PCB. Solder mask, silkscreen, special PCB. PCB component placing, component feeding. Soldering, phase diagram, lead-free solders, influence of impurities in solder, fluxes, solderability tests, wave soldering, reflow soldering, soldering in the vapor and by laser using. Solder paste, aplying paste, parameters. Metals, semimetals, nonmetals. Materials by use, semiconductors.

Literature

GINSBERG, Gerald L. Printed circuits design: featuring computer-aided technologies. New York: McGraw Hill, 1991. ISBN 0070233098.

Advised literature

PRASAD, Ray. Surface mount technology. Springer 1997. ISBN 0-412-12921-3 .


Language of instruction čeština, angličtina
Code 440-4105
Abbreviation TEZ
Course title Electronic Equipment Technology
Coordinating department Department of Telecommunications
Course coordinator Ing. Karel Witas, Ph.D.