Electronic Equipment Technology
| Language of instruction | angličtina, čeština |
|---|---|
| Code | 440-4105 |
| Abbreviation | TEZ |
| Course title | Electronic Equipment Technology |
| Coordinating department | Department of Telecommunications |
| Course coordinator | Ing. Karel Witas, Ph.D. |
Summary
Computer aided design of printed circuit board. Design of wiring diagram, PCB, documentation. Printed circuit board technology, multilayer PCB, materials for PCB. Solder mask, silkscreen, special PCB. PCB component placing, component feeding. Soldering, phase diagram, lead-free solders, influence of impurities in solder, fluxes, solderability tests, wave soldering, reflow soldering, soldering in the vapor and by laser using. Solder paste, aplying paste, parameters. Metals, semimetals, nonmetals. Materials by use, semiconductors.
Literature
GINSBERG, Gerald L. Printed circuits design: featuring computer-aided technologies. New York: McGraw Hill, 1991. ISBN 0070233098.