Printed Circuits and Discrete Elements Assembly

Bacis terms definition, package function (mechanical, electrical, thermal), package types. Package materials, chip and passive component materials, effect of thermal expansivity and mechanical stress, Chip level packaging, wire bonding, flip-chip, TAB, COB, DCA, packages direct on PCB. Multi-chip modules packaging, MCM technology, hybrid modules, Discrete components packaging, through hole devices, SMT technology. Printed circuit boards, materials and characteristics of PCB, PCBs for surface mounting technology, solder mask, surface preservatives. Components attaching on PCB, soldering, gluing with electrical conductive paste, placing, component feeding. Physical impacts on reliability, diagnostic methods. Mounting components under mechanical or temperature stress, connecting to heat sink, connector mounting.