Bacis terms definition, package function (mechanical, electrical, thermal), package types. Package materials, chip and passive component materials, effect of thermal expansivity and mechanical stress, Chip level packaging, wire bonding, flip-chip, TAB, COB, DCA, packages direct on PCB. Multi-chip modules packaging, MCM technology, hybrid modules, Discrete components packaging, through hole devices, SMT technology. Electromechanical components, push buttons, switches, trimmers, potenciometers, used materials, processing, parameters. Membrane and rubber keyboards. Electronic switches - optical, hall effect, capacitive. Potenciometer replacements. Passive components (materials, parameters, processing). Resistors - carbon composition, carbon film, metal film, foil, cermet, wire wound, trimming, construction, packages, marking. Inductors - core types, materials, package, winding types, processing. Ceramic capacitors - dielectrics, construction, processsing. Film capacitors. Tantalum capacitors - parameters, function. materials, processing. Electrolytic capacitors. Supercapacitors. Displays - LCD (TN, STN, DSTN, CSTN, IPS, MVA, Colesteric, TFT), EL, Plasma, OLED, PLED - parameters, function principles, types, processing, optical parameters, technology. Backlight of LCD (LED, EL,CCFL, EEFL). Components attaching on PCB, soldering, gluing with electrical conductive paste, placing, component feeding. Physical impacts on reliability, diagnostic methods. Mounting components under mechanical or temperature stress, connecting to heat sink, connector mounting.