1. Basic characteristics of electrical materials and requirements to them. Technology of preparation of physically and chemically highly pure materials. Physical, chemical and physical-chemical methods of refining metallic and non-metallic materials and their characterisation.
2. New types of electronic, opto-electronic and magnetic elements. Influence of electrically active elements on the properties of electronic components.
3. Materials with high electrical conductivity. Materials for contacts, thermocouples, bi-metals, solders, resistance materials. Superconductivity. Low-temperature and high-temperature superconductors.
4. Current technologies for production of semiconductor materials and integrated circuits, overall structure of technologies applied in micro-electronics, evolution and types of technologies, preparation of pads (substrates), bases of photo-lithography, basic materials used at creation of structure of semiconductor elements.
5. Elemental semiconductors and compounds, dielectric-layer and methods for their creation, metallic contacts and internal connections, micro-alloying, defects of semiconductor elements, principles of control and automation of technological processes.
6. Influence of geometrical dimensions on the properties of solids. Properties of nano-crystals and crystallisation nuclei, basic stages of formation of nano-layers and areas of their application, dimensional effects in the structure of electronic components.
7. Miniaturisation and topology of electronic devices, technological operations and functional properties of components, mechanisms of degradation of electronic elements.
8. Mechanism of elemental processes of growth of thin layers by epitaxy (VPE, LPE, MBE, MO CVD), by evaporation, by sputtering and ion implantation, by mechanisms of diffusion processes in semiconductors.
9. Principle of selectivity and procedures of technological operations in micro-electronics. Basic criteria for evaluation of local operations, methods of creation of topological pattern on a substrate, masking, locally activated operations, topological transformations and creation of additional structural elements using selective operations.
10. Creation of horizontal and vertical structures. Lithographical methods. EUV lithography, electron and ion projection lithography. Reactive ion etching. Technology for preparation of quantum dots based on semiconductors.
11. Final operations, physical methods for control of defects, composition and circuits for local operations, principal conditions for elimination of mechanical joints. Methods LP CVD, LE CVD, PETEOS. Micro- and nano-fabrication.
12. Micro-optoelectronics, compounds AIIIBV, AIIBVI…, materials for laser technology, radiation detectors, solar technology.
13. Magnetic and dielectric materials. Oxide materials for memory elements (ferrites, ferro-electrics), materials for bubble memories (garnets).
14. Liquid crystals. Nematic, lamellar and columnar systems - structure and its transformations, materials for special purposes, whiskers. Material engineering in micro-electronics.
2. New types of electronic, opto-electronic and magnetic elements. Influence of electrically active elements on the properties of electronic components.
3. Materials with high electrical conductivity. Materials for contacts, thermocouples, bi-metals, solders, resistance materials. Superconductivity. Low-temperature and high-temperature superconductors.
4. Current technologies for production of semiconductor materials and integrated circuits, overall structure of technologies applied in micro-electronics, evolution and types of technologies, preparation of pads (substrates), bases of photo-lithography, basic materials used at creation of structure of semiconductor elements.
5. Elemental semiconductors and compounds, dielectric-layer and methods for their creation, metallic contacts and internal connections, micro-alloying, defects of semiconductor elements, principles of control and automation of technological processes.
6. Influence of geometrical dimensions on the properties of solids. Properties of nano-crystals and crystallisation nuclei, basic stages of formation of nano-layers and areas of their application, dimensional effects in the structure of electronic components.
7. Miniaturisation and topology of electronic devices, technological operations and functional properties of components, mechanisms of degradation of electronic elements.
8. Mechanism of elemental processes of growth of thin layers by epitaxy (VPE, LPE, MBE, MO CVD), by evaporation, by sputtering and ion implantation, by mechanisms of diffusion processes in semiconductors.
9. Principle of selectivity and procedures of technological operations in micro-electronics. Basic criteria for evaluation of local operations, methods of creation of topological pattern on a substrate, masking, locally activated operations, topological transformations and creation of additional structural elements using selective operations.
10. Creation of horizontal and vertical structures. Lithographical methods. EUV lithography, electron and ion projection lithography. Reactive ion etching. Technology for preparation of quantum dots based on semiconductors.
11. Final operations, physical methods for control of defects, composition and circuits for local operations, principal conditions for elimination of mechanical joints. Methods LP CVD, LE CVD, PETEOS. Micro- and nano-fabrication.
12. Micro-optoelectronics, compounds AIIIBV, AIIBVI…, materials for laser technology, radiation detectors, solar technology.
13. Magnetic and dielectric materials. Oxide materials for memory elements (ferrites, ferro-electrics), materials for bubble memories (garnets).
14. Liquid crystals. Nematic, lamellar and columnar systems - structure and its transformations, materials for special purposes, whiskers. Material engineering in micro-electronics.