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Micro-electronic Circuit Technology

Language of instruction čeština
Code 454-0315
Abbreviation TMO
Course title Micro-electronic Circuit Technology
Coordinating department Department of Telecommunications
Course coordinator Ing. Radek Novák, Ph.D.

Summary

Subject is concern in initial materials and integrated structure manufacturing technology production and Integrated circuits, principle for three-dimensional bipolar and unipolar structure ordering, also considering resulting peripheral characteristics, automated design resources and its verification.

Literature

Texas Engineering Extension Service,Texas University Systém, College Station, Texas 1997,Silicon Materials Fabrication-Introduction and Review of Fundamental Concepts, Crystal Growth, Wafer Preparation, Epitaxial Deposition, Chemical Vapor Deposition, Oxidation/Diffusion, Wet Processes, WetDry Etch, CMP-Chemical Mechanical Polishing
Colclaser, R.A.: Micro-Electronics Processing and Device Design, The University of New Mexico, JW and S.,N.Y.,1997
Botkar, K.R.: Integrated Circuits, Indian Institute of Science, Bangalore 1997
Einspruch, N.G.; Larrabee,G.B.: VLSI Electronics Microstructure Science, TI Dallas, Texas,Academic Press,1983
Wolf, S.; Tauber,R.N.: Silicon Processing for the VLSI ERA-Process Technology, Lattice Press,Sunset Beach, 1990
Gray, P.R.; Meyer,R.G.: Analysis and Design of Analog Integrated Circuits,University of California, Berkeley, JW and S.,N.Y.,1997
Dekker, M.: Handbook of Semiconductor Manufacturing Technology, ISBN: 0-8247-8783-8 , Inc.,2000.
Dekker, M.: Microlithography Fundamentals in Semiconductor Devices and Fabrication Technology, ISBN: 0-8247-9951-8 , Inc.,2000.
Fy.Literature: Wacker Siltronic-Wafers for the World of Microchips, 2000.
Schroder, D.K.: Semiconductor Material and Device Characterization, Arizona State University, Tempe, Arizona, JW and S.,N.Y.,1999

Advised literature

No advised literature has been specified for this subject.