Fabian Ziervogel

Fabian Ziervogel

Since 2020, Fabian Ziervogel has been working as a research associate at Fraunhofer IWU in the Functionalization Technologies department. From the outset, his main focus has been on the cost-efficient production of additively manufactured functional structures. Fabian developed the WEAM process in 2021 and has been responsible for this technology field ever since. The core element of his work is the development and refinement of specialized tool heads to open up new materials and fields of application. In a variety of industrial collaborations, he develops best-case solutions for specific applications. Starting in 2026, he will make WEAM technology available on the market through a spin-off.

Beyond Printed Electronics: Wire Encapsulation Additive Manufacturing for Functional Integration, Lightweight Design, and Sustainable Manufacturing

Presentation abstract: The growing volume of electronic waste and the environmental impact of traditional manufacturing demand new approaches for integrating electronic functionality into products. Wire Encapsulation Additive Manufacturing (WEAM) presents a scalable, cost efficient solution that embeds solid metal wires directly into thermoplastic structures. This technology enables fully automated production of functional components while reducing material diversity, transportation needs, and manual assembly steps. By combining polymer deposition with precise wire placement, WEAM allows the creation of sensors, heaters, antennas, and complex wiring layouts in a single manufacturing process. The method supports recyclable one material systems, high performance wire functions, and compatibility with industrial workflows such as thermoforming and overmolding. Application examples—including structural circuit boards, flexible wire harnesses, high temperature flat cables, strain sensors, and integrated heating elements for automotive radar systems—demonstrate the versatility of the approach. WEAM bridges the gap between additive manufacturing and functional electronics, enabling lightweight designs, improved sustainability, and new degrees of design freedom for consumer goods, mobility, and industrial applications.