| Course Unit Code | 440-4105/01 |
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| Number of ECTS Credits Allocated | 4 ECTS credits |
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| Type of Course Unit * | Optional |
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| Level of Course Unit * | Second Cycle |
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| Year of Study * | First Year |
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| Semester when the Course Unit is delivered | Winter Semester |
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| Mode of Delivery | Face-to-face |
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| Language of Instruction | Czech |
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| Prerequisites and Co-Requisites | There are no prerequisites or co-requisites for this course unit |
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| Name of Lecturer(s) | Personal ID | Name |
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| WIT005 | Ing. Karel Witas, Ph.D. |
| Summary |
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| Computer aided design of printed circuit board. Design of wiring diagram, PCB, documentation. Printed circuit board technology, multilayer PCB, materials for PCB. Solder mask, silkscreen, special PCB. PCB component placing, component feeding. Soldering, phase diagram, lead-free solders, influence of impurities in solder, fluxes, solderability tests, wave soldering, reflow soldering, soldering in the vapor and by laser using. Solder paste, aplying paste, parameters. Metals, semimetals, nonmetals. Materials by use, semiconductors. |
| Learning Outcomes of the Course Unit |
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After course finishing student will be knowing the equipment design requirements from production technology perspective.
Learning outcomes are set in such way that the students are able to identify, apply and solve tasks in the field of electronic equipment technology.
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| Course Contents |
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Lectures:
Computer aided design of printed circuit boards (OrCAD, Pads, Protel, Eagle, KiCAD). System Eagle - wiring diagram drawing, printed circuit board design, component pinout design, finall processing. 3 lectures total.
Printed circuit boards technologies. Subtract and aditive technologies. Precision classes. PCB materials. Etching solution, underetching. Fotoresists and their spreading. Drilling and its particularity. Holes metal coating. Silk-screen. Multi-layer PCB and flexible PCB manufacturing. 2 lectures total.
Materials, their characteristics and aplication. Common material characteristics. Crystalography. High conductance materials, refractory materials, semimetals, nonmetals). Materials application (resistors, contacts, solders, magnets, vacuum systems). Isolants and dielectrics (plastics, glasses, ceramics). Semiconductors. Workability. Size stability. Natural and accelerated aging. Weather endurance. 3 lectures total.
Thermoplastics and thermosets processing. Pressing and casting. Technological requirements on model and form. Cutting, gluing and drilling. Glues for mechanical connection. Electrical conductive glues. Cements. Metal plates processing, soldering, welding, point welding. Welding deformation and its correction. Cutting, drilling, punching. Laser cutting, water jet cutting. Screw threads in plate. Bending. Bolts using. 2 lectures total.
Surface finishing and protection against corrosion: painting, protective layer electrostatic deposition, chemical and electrochemical oxidation, aluminium anodic oxidation, metal plating. Heat-up oxidation, acid and liquid alloy soulution dipping, electrolytic oxidation. Isolation lackers. Lackers for conductors, cloth, paper. Impregnation lackers. Application technologies. 1 lecture.
Solders, solding and cleaning. Tin-lead solders for electronics, state diagram. Soledered joint metallography. Lead-free solders. Additives. Aging. Mechanical characteristics. Solder pastes. Screening, dispenser aplying. Reflow soldering, wave soldering, laser soldering. Fluxes, their composition. Health and ecological aspects of fluxes and solders. Removing flux residuals form PCB. Tinning (HAL). 2 lectures total.
Audit trail, testing. Production waste disposal. Types of discrete components, package types, placing, joint heat stress. Surface mounted devices. 1206, 0805, MELF packages. IC packaging SOT, SOIC, PLCC, QFP, PGA, TAB... SMD devices placing. Packaging for automatic placing. Gluing before soldering. Tombstoning. Repair on finished PCB. 1 lecture.
Laboratories:
8. week - Microsolder handling, paste handling, reflow in hot air, unsoldering high pin count components with hot air, ball forming from solder paste. Screening familiarization. Soldering by dipping.
9. and 10. week - Excursion (in case of interest), soldering, PCB examples, documentation creating.
11. week - Documentation (components placing diagram, list of components). Components placing and soldering.
12. week - Component placing and soldering.
13. week - Component placing and soldering.
14. week - Component placing and soldering. PCB and documentation submission.
Computer laboratories:
1. week - Introduction, requirements for credit, safety in laboratory, familiarization with software for PCB design.
2. week - Project - device assignment, whose PCB will be designed, components placed and soldered. Students can choose their own device. Wiring diagram drawing in Eagle SW.
3. week - PCB design in Eagle SW.
4. week - PCB final processing, library creating.
5. week - Project PCB design in Eagle SW.
6. week - Project PCB design in Eagle SW.
7. week - Project PCB design in Eagle SW. Gerber2Bitmap and RunPlotter SW familiarization. PCB design submission for manufacturing. |
| Recommended or Required Reading |
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| Required Reading: |
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GINSBERG, Gerald L. Printed circuits design: featuring computer-aided technologies. New York: McGraw Hill, 1991. ISBN 0070233098.
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ŠAVEL, Josef. Elektrotechnologie: materiály, technologie a výroba v elektronice a elektrotechnice. 4., rozš. vyd. Praha: BEN - technická literatura, 2005. ISBN 80-7300-190-X.
MACH, Pavel, Jan URBÁNEK a Vlastimil SKOČIL. Montáž v elektronice: pouzdření aktivních součástek, plošné spoje. Praha: Vydavatelství ČVUT, 2001. ISBN 80-01-02392-3.
SZENDIUCH, Ivan. Mikroelektronické montážní technologie. Brno: VUTIUM, 1997. ISBN 80-214-0901-0.
GINSBERG, Gerald L. Printed circuits design: featuring computer-aided technologies. New York: McGraw Hill, 1991. ISBN 0070233098.
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| Recommended Reading: |
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| PRASAD, Ray. Surface mount technology. Springer 1997. ISBN 0-412-12921-3. |
WITAS, Karel. Materiály a techniky při realizaci elektronických obvodů pro integrovanou výuku VUT a VŠB-TUO. Ostrava: Vysoká škola báňská - Technická univerzita Ostrava, Fakulta elektrotechniky a informatiky, katedra telekomunikační techniky, 2014. ISBN 978-80-248-3567-9.
ABEL, Martin. SMT Technologie povrchové montáže. Pardubice: Platan, 2000. ISBN 80-902733-1-9.
ABEL, Martin. Plošné spoje se SMD, návrh a konstrukce. Pardubice: Platan, 2000. ISBN 80-902733-2-7.
PRASAD, Ray. Surface mount technology. Springer 1997. ISBN 0-412-12921-3. |
| Planned learning activities and teaching methods |
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| Lectures, Tutorials, Experimental work in labs, Project work |
| Assesment methods and criteria |
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| Task Title | Task Type | Maximum Number of Points
(Act. for Subtasks) | Minimum Number of Points for Task Passing |
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| Exercises evaluation and Examination | Credit and Examination | 100 (100) | 51 |
| Exercises evaluation | Credit | 40 | 10 |
| Examination | Examination | 60 | 10 |